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Our Capabilities

Our capabilities span a wide range of advanced fabrication and characterization techniques. Most equipment can handle samples from small pieces up to 150mm diameter samples. We are committed to providing cutting-edge solutions with precision and reliability, supported by the same high standards as the University of Michigan's Lurie Nanofabrication Facility.

Lithography

Contact Lithography

  • Contact aligner with a min feature size of ~1.5µm

  • Backside alignment capability

  • Bond alignment

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Projection Lithography

  • 5x reduction i-line stepper with a min feature size of ~0.5µm

  • Die sizes upto 14.7 mm

  • ​10mm square pieces up to 150mm substrate capability

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Mask Making

  • ​Direct write mask maker

  • 4" and 5" masks with a min feature size of 1µm

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Photoresist Coating

  • Automated photoresist dispense and development for 4" and 6" wafers - SPR 220/955

  • Manual coating of SPR 220/955, S1813, LOR, HMDS and AZ 12XT - pieces up to 6" wafers

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Soft Lithography​

  • SU-8 and PDMS

Etching

Dry Etching

  • ​Reactive Ion Etching (RIE) of Si, SiO2, SiOxNy, Si3N4, AlN, Al2O3, III-V, parylene, PDMS, glass, metals

  • Deep RIE of Si, glass, oxide, quartz, SiC

  • XeF2 etching of silicon

  • Ion milling

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Wet Etching​​

  • Isotropic Si, Ge, SiGe etching

  • Metals - Au, Ti, Ni, Cr, W, TiW, Al

  • Dielectrics - SiO2, Si3N4, Al2O3, Ti2O3, Ta2O5

  • KOH and TMAH

Deposition

Chemical Vapor Deposition (CVD)

  • LPCVD for low and high-temperature SiO2, Si3N4, SiOxNy, low stress SiN, polySi, PSG, TEOS

  • PECVD for SiO2, Si3N4, SiOxNy, a-Si

  • Parylene

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​Physical Vapor Deposition (PVD)

  • Semiconductors - Si, Ge, SiGe

  • Metals - Ag, Al, Au, Cr, Co, Cu, Fe, Ir, Mo, Ni, Pd, Pt, Ta, Ti, W-Ti-W, W and more

  • Dielectrics - AlN, Al2O3, C, SiO2, Si3N4, Ta2O5, TiN, TiO2

  • Metal Oxides - AZO, IGZO, ITO, ZnO

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Atomic Layer Deposition (ALD)

  • Al2O3, HfO2, ZnO, TiO2, SiO2, and Pt

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Diffusion/Oxidation/Doping/Annealing

  • Dry & wet oxidation

  • n- and p- type doping, anneal and oxidation

  • Rapid thermal and high-temperature (1800°C) annealing

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Electroplating

  • Cu, Au, Ag, Pt, Ni, Fe-Ni, In

Metrology

Scanning Electron Microscopy

  • Field Emission SEM with Energy-Dispersive X-ray Spectroscopy

  • Can process pieces up to 6" wafers

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Atomic Force Microscopy

  • ​Bruker ICON AFM

  • Topography mapping and roughness measurements

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Ellipsometry & Reflectometry

  • Woollam M-2000 Ellipsometer​

  • Reflectometer KLA Filmetrics F54

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Profilometry

  • Dektak XT stylus profilometer

  • Zygo NewView 5000 optical 3D profiler

  • Can process pieces up to 6" wafers

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FTIR Spectroscopy

  • Agilent uFTIR microscope

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